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GTL2012
2-bit LVTTL to GTL transceiver
Rev. 01 -- 9 August 2007 Product data sheet
1. General description
The GTL2012 is a 2-bit translating transceiver designed for 3.3 V system interface with a GTL-/GTL/GTL+ bus. The direction pin (DIR) allows the part to function as either a GTL-to-LVTTL sampling receiver or as an LVTTL-to-GTL interface. The GTL2012 LVTTL inputs (only) are tolerant up to 5.5 V allowing direct access to TTL or 5 V CMOS inputs.
2. Features
I Operates as a 2-bit GTL-/GTL/GTL+ sampling receiver or as an LVTTL to GTL-/GTL/GTL+ driver I 3.0 V to 3.6 V operation with 5 V tolerant LVTTL input I GTL input and output 3.6 V tolerant I Vref adjustable from 0.5 V to 0.5VCC I Partial power-down permitted I Latch-up protection exceeds 500 mA per JESD78 I ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-CC101 I Package offered: TSSOP8 (MSOP8) and VSSOP8
3. Quick reference data
Table 1. Quick reference data Recommended operating conditions; Tamb = 25 C Symbol Ci Cio Parameter input capacitance input/output capacitance Conditions control inputs; VI = 3.0 V or 0 V A port; VO = 3.0 V or 0 V B port; VO = VTT or 0 V GTL; Vref = 0.8 V; VTT = 1.2 V tPLH tPHL tPLH tPHL
[1]
Min -
Typ[1] 2 4.6 3.4 2.8 3.4 5.2 4.9
Max 2.5 6 4.3 5 7 8 7
Unit pF pF pF ns ns ns ns
LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay
An to Bn; see Figure 4 An to Bn; see Figure 4 Bn to An; see Figure 5 Bn to An; see Figure 5
All typical values are measured at VCC = 3.3 V and Tamb = 25 C.
NXP Semiconductors
GTL2012
2-bit LVTTL to GTL transceiver
4. Ordering information
Table 2. Ordering information Tamb = -40 C to +85 C Type number GTL2012DP GTL2012DC Topside mark 012P 012C Package Name TSSOP8[1] VSSOP8 Description plastic thin shrink small outline package; 8 leads; body width 3 mm plastic very thin shrink small outline package; 8 leads; body width 2.3 mm Version SOT505-1 SOT765-1
[1]
Also known as MSOP8.
5. Functional diagram
GTL2012
&
B0
A0
&
B1
A1
002aab605
VREF
DIR
Fig 1. Logic diagram of GTL2012
GTL2012_1
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Product data sheet
Rev. 01 -- 9 August 2007
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NXP Semiconductors
GTL2012
2-bit LVTTL to GTL transceiver
6. Pinning information
6.1 Pinning
A0 A1 DIR GND
1 2 3 4
002aab606
8 7
VCC VREF B0 B1
A0 A1 DIR GND
1 2 3 4
002aac398
8
VCC VREF B0 B1
GTL2012DP
6 5
GTL2012DC
7 6 5
Fig 2. Pin configuration for TSSOP8 (MSOP8)
Fig 3. Pin configuration for VSSOP8
6.2 Pin description
Table 3. Symbol A0 A1 DIR GND B1 B0 VREF VCC Pin description Pin 1 2 3 4 5 6 7 8 GTL reference voltage positive supply voltage direction control input (LVTTL) ground (0 V) data inputs/outputs (B side, GTL) Description data inputs/outputs (A side, LVTTL)
7. Functional description
Refer to Figure 1 "Logic diagram of GTL2012".
7.1 Function table
Table 4. Function table H = HIGH voltage level; L = LOW voltage level. Input DIR H L Input/output A (LVTTL) inputs An = Bn B (GTL) Bn = An inputs
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Product data sheet
Rev. 01 -- 9 August 2007
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NXP Semiconductors
GTL2012
2-bit LVTTL to GTL transceiver
8. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK VI IOK VO IOL IOH Tstg
[1] [2] [3] [4]
Parameter supply voltage input clamping current input voltage output clamping current output voltage LOW-level output current[2] current[3]
Conditions VI < 0 V A port B port VO < 0 V output in OFF or HIGH state; A port output in OFF or HIGH state; B port A port B port A port
[4] [1] [1] [1] [1]
Min -0.5 -0.5 -0.5 -0.5 -0.5 -60
Max +4.6 -50 +7.0 +4.6 -50 +7.0 +4.6 32 80 -32 +150
Unit V mA V V mA V V mA mA mA C
HIGH-level output
storage temperature
The input and output negative voltage ratings may be exceeded if the input and output clamping current ratings are observed. Current into any output in the LOW state. Current into any output in the HIGH state. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 C.
9. Recommended operating conditions
Table 6. Recommended operating conditions[1] Unused inputs must be held HIGH or LOW to prevent them from floating. Symbol VCC VTT Parameter supply voltage termination voltage[2] GTL- GTL GTL+ Vref reference voltage overall GTL- GTL GTL+ VI VIH VIL IOH input voltage HIGH-level input voltage LOW-level input voltage HIGH-level output current B port except B port B port except B port B port except B port A port
[3]
Conditions
Min 3.0 0.85 1.14 1.35 0.5 0.5 0.76 0.87 0 0 Vref + 0.050 2 -
Typ 0.9 1.2 1.5
2 V 3 TT
Max 3.6 0.95 1.26 1.65 0.5VCC 0.63 0.84 1.10 3.6 5.5 Vref - 0.050 0.8 -16
Unit V V V V V V V V V V V V V V mA
0.6 0.8 1.0 VTT 3.3 -
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Product data sheet
Rev. 01 -- 9 August 2007
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NXP Semiconductors
GTL2012
2-bit LVTTL to GTL transceiver
Table 6. Recommended operating conditions[1] ...continued Unused inputs must be held HIGH or LOW to prevent them from floating. Symbol IOL Tamb
[1] [2] [3]
Parameter LOW-level output current ambient temperature
Conditions B port A port operating in free-air
Min -40
Typ -
Max 40 16 +85
Unit mA mA C
Unused inputs must be held HIGH or LOW to prevent them from floating. VTT maximum of 3.6 V with resistor sized so IOL maximum is not exceeded. A0, A1 VI(max) is 3.6 V if configured as outputs (DIR = L).
10. Static characteristics
Table 7. Static characteristics Recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = -40 C to +85 C. Symbol VOH VOL Parameter HIGH-level output voltage LOW-level output voltage Conditions A port; VCC = 3.0 V to 3.6 V; IOH = -100 A A port; VCC = 3.0 V; IOH = -16 mA B port; VCC = 3.0 V; IOL = 40 mA A port; VCC = 3.0 V; IOL = 8 mA A port; VCC = 3.0 V; IOL = 12 mA A port; VCC = 3.0 V; IOL = 16 mA II input current control inputs; VCC = 3.6 V; VI = VCC or GND B port; VCC = 3.6 V; VI = VTT or GND A port; VCC = 0 V or 3.6 V; VI = 5.5 V A port; VCC = 3.6 V; VI = VCC A port; VCC = 3.6 V; VI = 0 V IOZ ICC off-state output current supply current A port; VCC = 0 V; VI or VO = 0 V to 3.6 V A port; VCC = 3.6 V; VI = VCC or GND; IO = 0 mA B port; VCC = 3.6 V; VI = VTT or GND; IO = 0 mA ICC[3] Ci Cio additional supply current input capacitance input/output capacitance per input; A port or control inputs; VCC = 3.6 V; VI = VCC - 0.6 V control inputs; VI = 3.0 V or 0 V A port; VO = 3.0 V or 0 V B port; VO = VTT or 0 V
[2] [2] [2] [2] [2] [2]
Min 2.0 -
Typ[1] 0.23 0.28 0.40 0.55 4 4 2 4.6 3.4
Max 0.4 0.4 0.55 0.8 1 1 10 1 -5 100 10 10 500 2.5 6 4.3
Unit V V V V V V A A A A A A mA mA A pF pF pF
VCC - 0.2 -
[1] [2] [3]
All typical values are measured at VCC = 3.3 V and Tamb = 25 C. The input and output voltage ratings my be exceeded if the input and output current ratings are observed. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
GTL2012_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 9 August 2007
5 of 14
NXP Semiconductors
GTL2012
2-bit LVTTL to GTL transceiver
11. Dynamic characteristics
Table 8. Dynamic characteristics VCC = 3.3 V 0.3 V Symbol tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL
[1]
Parameter LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay
Conditions An to Bn; see Figure 4 An to Bn; see Figure 4 Bn to An; see Figure 5 Bn to An; see Figure 5 An to Bn; see Figure 4 An to Bn; see Figure 4 Bn to An; see Figure 5 Bn to An; see Figure 5 An to Bn; see Figure 4 An to Bn; see Figure 4 Bn to An; see Figure 5 Bn to An; see Figure 5
Min -
Typ[1] 2.8 3.3 5.3 5.2 2.8 3.4 5.2 4.9 2.8 3.4 5.1 4.7
Max 5 7 8 8 5 7 8 7 5 7 8 7
Unit ns ns ns ns ns ns ns ns ns ns ns ns
GTL-; Vref = 0.6 V; VTT = 0.9 V
GTL; Vref = 0.8 V; VTT = 1.2 V
GTL+; Vref = 1.0 V; VTT = 1.5 V
All typical values are at VCC = 3.3 V and Tamb = 25 C.
11.1 Waveforms
VM = 1.5 V at VCC 3.0 V; VM = 0.5VCC at VCC 2.7 V for A ports and control pins; VM = Vref for B ports.
3.0 V input 1.5 V tPLH 3.0 V VM VM 0V
002aab140 002aab141
1.5 V 0V tPHL VOH Vref Vref VOL
tp output
VM = 1.5 V for B port and Vref for A port
B port to A port
a. Pulse duration Fig 4. Voltage waveforms
b. Propagation delay times
GTL2012_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 9 August 2007
6 of 14
NXP Semiconductors
GTL2012
2-bit LVTTL to GTL transceiver
3.0 V input Vref tPLH output 1.5 V Vref 0V tPHL VOH 1.5 V VOL
002aab163
PRR 10 MHz; Zo = 50 ; tr 2.5 ns; tf 2.5 ns
Fig 5. Propagation delay, An to Bn
12. Test information
VCC PULSE GENERATOR VI DUT
RT CL 50 pF RL 500
VO
002aab006
Fig 6. Load circuitry for switching times
VTT VCC PULSE GENERATOR VI DUT
RT CL 30 pF 25
VO
002aab143
Fig 7. Load circuit for B outputs
RL -- Load resistor. CL -- Load capacitance; includes jig and probe capacitance. RT -- Termination resistance; should be equal to Zo of pulse generators.
GTL2012_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 9 August 2007
7 of 14
NXP Semiconductors
GTL2012
2-bit LVTTL to GTL transceiver
13. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1
D
E
A
X
c y HE vMA
Z
8
5
A2 pin 1 index
A1
(A3)
A
Lp L
1
e bp
4
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.45 0.25 c 0.28 0.15 D(1) 3.1 2.9 E(2) 3.1 2.9 e 0.65 HE 5.1 4.7 L 0.94 Lp 0.7 0.4 v 0.1 w 0.1 y 0.1 Z(1) 0.70 0.35 6 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT505-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-04-09 03-02-18
Fig 8. Package outline SOT505-1 (TSSOP8)
GTL2012_1 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 9 August 2007
8 of 14
NXP Semiconductors
GTL2012
2-bit LVTTL to GTL transceiver
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
E
A X
c y HE vMA
Z
8
5
Q A pin 1 index A2 A1 (A3) Lp L
1
e bp
4
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1 A1 0.15 0.00 A2 0.85 0.60 A3 0.12 bp 0.27 0.17 c 0.23 0.08 D(1) 2.1 1.9 E(2) 2.4 2.2 e 0.5 HE 3.2 3.0 L 0.4 Lp 0.40 0.15 Q 0.21 0.19 v 0.2 w 0.13 y 0.1 Z(1) 0.4 0.1 8 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC MO-187 JEITA EUROPEAN PROJECTION
ISSUE DATE 02-06-07
Fig 9. Package outline SOT765-1 (VSSOP8)
GTL2012_1 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 9 August 2007
9 of 14
NXP Semiconductors
GTL2012
2-bit LVTTL to GTL transceiver
14. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus PbSn soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities
GTL2012_1 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 9 August 2007
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NXP Semiconductors
GTL2012
2-bit LVTTL to GTL transceiver
14.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 10) than a PbSn process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9 and 10
Table 9. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 10. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 10.
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(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 9 August 2007
11 of 14
NXP Semiconductors
GTL2012
2-bit LVTTL to GTL transceiver
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 10. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
15. Abbreviations
Table 11. Acronym CDM CMOS DUT ESD GTL HBM LVTTL MM PRR TTL Abbreviations Description Charged Device Model Complementary Metal Oxide Silicon Device Under Test ElectroStatic Discharge Gunning Transceiver Logic Human Body Model Low Voltage Transistor-Transistor Logic Machine Model Pulse Repetition Rate Transistor-Transistor Logic
16. Revision history
Table 12. Revision history Release date 20070809 Data sheet status Product data sheet Change notice Supersedes Document ID GTL2012_1
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Product data sheet
Rev. 01 -- 9 August 2007
12 of 14
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GTL2012
2-bit LVTTL to GTL transceiver
17. Legal information
17.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
17.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
18. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
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(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 9 August 2007
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NXP Semiconductors
GTL2012
2-bit LVTTL to GTL transceiver
19. Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 8 9 10 11 11.1 12 13 14 14.1 14.2 14.3 14.4 15 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Introduction to soldering . . . . . . . . . . . . . . . . . 10 Wave and reflow soldering . . . . . . . . . . . . . . . 10 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 10 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 9 August 2007 Document identifier: GTL2012_1

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